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Facility staff

Ben Blackburn

Technical Services Manager, Physics and Engineering

Holly Pearce

Senior Technician (operations)

Christina Missirli

Technical Manager (Operations) and Departmental Safety Officer

We're proud to offer a collection of state of the art equipment for use.

Related equipment

Hitachi IM400 Ion Miller
Hitachi IM400 Ion Miller

Hitachi ion miller for incisions on thin films and devices. 5mm argon ion beam with a max flat mill rate of 20μm/hr or 300μm/hr for cross section milling.

Laurel Spin Coater
Laurell WS-400A-6NPP-LITE Spin Coater

Spin Coater with chucks for samples from 3mm up 50mm diameter

Femto 1A Plasma Cleaner
Femto 1A Plasma Cleaner

Low Pressure system for plasma cleaning, ashing or etching materials

SRF Quorum 150TS Gold Sputter Coater
Quorum 150TS Gold Sputter Coater

Sputter coater for up to 10nm of surface adherant gold film, primarilly for SEM Sample Prep

Leybold Thermal Evaporator Chamber
Leybold Thermal Evaporator

Low-vac system for up to 100 nm coatings of gold, aluminium, silver and nichrome

Inesto ibond wire bonder
Inseto i-Bond 5000 Wire Bonder

Primarilly used for linking conductive surfaced by creating ball bonds with ultrafine gold wire.

Facility staff

Ben Blackburn

Technical Services Manager, Physics and Engineering

Holly Pearce

Senior Technician (operations)

Christina Missirli

Technical Manager (Operations) and Departmental Safety Officer

We're proud to offer a collection of state of the art equipment for use.

Related equipment

Hitachi IM400 Ion Miller
Hitachi IM400 Ion Miller

Hitachi ion miller for incisions on thin films and devices. 5mm argon ion beam with a max flat mill rate of 20μm/hr or 300μm/hr for cross section milling.

Laurel Spin Coater
Laurell WS-400A-6NPP-LITE Spin Coater

Spin Coater with chucks for samples from 3mm up 50mm diameter

Femto 1A Plasma Cleaner
Femto 1A Plasma Cleaner

Low Pressure system for plasma cleaning, ashing or etching materials

SRF Quorum 150TS Gold Sputter Coater
Quorum 150TS Gold Sputter Coater

Sputter coater for up to 10nm of surface adherant gold film, primarilly for SEM Sample Prep

Leybold Thermal Evaporator Chamber
Leybold Thermal Evaporator

Low-vac system for up to 100 nm coatings of gold, aluminium, silver and nichrome

Inesto ibond wire bonder
Inseto i-Bond 5000 Wire Bonder

Primarilly used for linking conductive surfaced by creating ball bonds with ultrafine gold wire.