Thin Film Deposition
Thin Film Deposition Metallic Films can be depositied using the Leybold Thermal Evaporator or the Quorum 150TS Sputter Coater. Organic or nanoparticulate films can be depositied using the Laurell Spin Coater.
Surface Modification
Surfaces can be etched using the Femto 1A Plasma Cleaner or the Hitachi IM400 Ion Miller.
We're proud to offer a collection of state of the art equipment for use.
Related equipment
Hitachi IM400 Ion Miller
Hitachi ion miller for incisions on thin films and devices. 5mm argon ion beam with a max flat mill rate of 20μm/hr or 300μm/hr for cross section milling.
Laurell WS-400A-6NPP-LITE Spin Coater
Spin Coater with chucks for samples from 3mm up 50mm diameter
Femto 1A Plasma Cleaner
Low Pressure system for plasma cleaning, ashing or etching materials
Quorum 150TS Gold Sputter Coater
Sputter coater for up to 10nm of surface adherant gold film, primarilly for SEM Sample Prep
Leybold Thermal Evaporator
Low-vac system for up to 100 nm coatings of gold, aluminium, silver and nichrome
Inseto i-Bond 5000 Wire Bonder
Primarilly used for linking conductive surfaced by creating ball bonds with ultrafine gold wire.
Thin Film Deposition
Thin Film Deposition Metallic Films can be depositied using the Leybold Thermal Evaporator or the Quorum 150TS Sputter Coater. Organic or nanoparticulate films can be depositied using the Laurell Spin Coater.
Surface Modification
Surfaces can be etched using the Femto 1A Plasma Cleaner or the Hitachi IM400 Ion Miller.
Facility staff
We're proud to offer a collection of state of the art equipment for use.
Related equipment
Hitachi IM400 Ion Miller
Hitachi ion miller for incisions on thin films and devices. 5mm argon ion beam with a max flat mill rate of 20μm/hr or 300μm/hr for cross section milling.
Laurell WS-400A-6NPP-LITE Spin Coater
Spin Coater with chucks for samples from 3mm up 50mm diameter
Femto 1A Plasma Cleaner
Low Pressure system for plasma cleaning, ashing or etching materials
Quorum 150TS Gold Sputter Coater
Sputter coater for up to 10nm of surface adherant gold film, primarilly for SEM Sample Prep
Leybold Thermal Evaporator
Low-vac system for up to 100 nm coatings of gold, aluminium, silver and nichrome
Inseto i-Bond 5000 Wire Bonder
Primarilly used for linking conductive surfaced by creating ball bonds with ultrafine gold wire.