Location: Strand Building S-1.19

Ultrasonic Wedge and Ball bonder for wire & ribbon gold wire processes. Comprehensive range of work holders and customised fixtures User friendly touch screen graphical user interface and a large bondable substrate area: 135 mm x 135 mm

The bonder unit features easy to use touch screen interface controls and a sensitive roller mouse pad for substrate movement, ensuring accuracy in placing bonds

The system enables saving and loading of custom files, along with factory pre-configured profiles, for storing, cataloguing, and re-using gold bonding processes.

The I-bond 5000 is also capable of creating bonds using aluminium wire using an internal nitrogen flow to prevent oxidation.