Laser Micro-machining
MAISI features state-of-the-art laser technology for cutting and welding various materials. With a working area of up to 300 x 300 mm² and a motion range of ± 100 mm, equipped with a high-precision rotary chuck designed for tubes starting from 2 mm diameter, our unit ensures flexibility and precision in fabricating critical components for medical devices.
Application examples: Hermetic packages such as pacemakers or neurostimulators.
Equipment available:
- Optek’s MM2500 platform, custom designed for cutting and welding applications, equipped with a quasi-continuous wave (QCW) fibre laser, operating in the near infrared wave length and with 150W of power.
- Lotus desktop laser machine to engrave precious metal, equipped with a 30W MOPA (Master Oscillator Power Amplifier) fibre laser.
- Fisherbrand P-Series ultrasonic cleaner, heated, multi-frequency (37 kHz and 80kHz) and chemical resistant.
- Electro polishing set-up (in-house development), for requirements up to 300W.
Laser Machining Capabilities
MAISI has a fleet of laser machining equipment to enable the processing of metallic, ceramic and polymer components. A comprehensive range of laser powers and sources including diode pumped solid state and Ytterbium doped optical fibre allow for an array of applications including welding, cutting and marking.
Laser Capabilities
Our capabilities extend across the pulse width range from ultrashort pulse femtosecond through to microsecond and millisecond pulse width providing flexibility of processing depths and heat affected zones (HAZ).