Lamination and Firing
Equipped with a high-precision screen printer, hydraulic hot press, and sintering furnace, our facility specializes in the lamination and firing of critical components such as HTCC and multilayer hybrids (substrate sizes up to 100 x 100 mm²). Our ISO-7 cleanroom environment ensures a “particle-free” environment essential for highly reliable circuits.
Application examples: Multilayer ceramic components for hermetic feedthroughs.
Equipment available:
- Screen printer
- Binder oven with forcer convection
- Carbolite RHF range up to 1,600 °C, with advanced controller for multiple step heating cycle
- Unitemp VPO-300 for Rapid Thermal Processing, up to 1,100 °C in 10 minutes. Controlled atmosphere using two types of gas or high vacuum (10E-3 hPa).
- Heat press